Techno
UNIT 1. CAD / CAE / CAM
CAD (computer aided design) technique of designing a computer-based product and its capture programas.Programa schemes.
-Editor: photo editor (library of components)
-Processor (database connectivity): rendering the ct. Designed by simulation programs or implantation in pcb.
Electronic CAE (computer aided engineering): checking the proper functioning of the product designed by computerized means.
Electronic CAM (computer aided manufacturing) manufacturing process control with the help of computer and software. PCB design software. Generation of documentation and information to the practical implementation of product design.
Basis for choosing a CAD / CAE / CAM:
The characteristics examined are:
1.-power design sma (potential of the design package):
a) capture schemes: No library (the larger, more components will) and generation of database connectivity in different formats.
b) simulation: it must belong to the same database schema to capture and pcb layout.
c) PCB design: largely determines the power of design sma. The autorruter always had as main objectives:
-route the board 100%
-route the board in the shortest time possible
quality-routed: Interconnections.
2.-Computer hardware (required for the proper functioning of the package)
a) technological development:
-computing needs for installation and automatic drawing
-Requirements powerful graphics.
-Local Area Network (sharing programs, libraries, components)
b) applications: a computer MEASUREMENT PRINCIPLE was not suitable for the design but the evolution of these is transforming the PC into a sma as powerful as workstations.
ITEM 2. Laminates
Functions of a paper plate: bear down components and interconnections
Advantages against cables: space saving, ease of component assembly, no broken threads or cuts repitibilidad + + + uniform electrical characteristics reliability, simplifying identification of parts of the ct, mass production and automated, no qualified employees easy review (less errors)
Limitations of electrical cts: the ability for the designer, longer designed, difficult to repair, little more expensive production
Building blocks: insulating base mounting holes or pathways components, connectors, interconnect plates, terminal E / S, conductive material
Classification of printed boards:
-based support: rigid or flexible
“No planes drivers: SC or DC or MC
Factors cts density printed size and shape of components, number of drivers and components, complexity of conexiones.Medida density = number of holes / unit area
Classification system 1erdígito: type of plate (SC, DC, MC) and interconnection. 2 nd digit: The maximum concentration of drivers depends on: nominal width of the components, nominal separation between conductors, differences between diameters nodes depends on: nominal width components, nominal separation between conductors, differences between diameters nodes and holes
Materials used in the media:
Char: Physical: robustness and stability. Thermal: fabricac support processes, coef tmp.dl mat.Electrical: dielectric strength, insulation resistance.
Materials:
-Paper impregnated with phenolic resins in them (bakelite). (Holes metallic)
-Polyester rigid fiberglass impregnated in it.
Epoxy resin-impregnated paper with it.
Epoxy resin-glass fiber impregnated paper in it (needle metallic).
-Blade Mylar, Teflon (flexible)
Limitations of size and shape of the CI: size of equipment, tools available, manufacturing facilities
Factors affecting costs: No layers (conducting planes), customer specifications, selection of base material “base material thickness (rigid plates 0.6 <glass epoxy <1.6-2mm tolerance +)-conductive layer thickness, size of nodes and holes, interconnect design, maintenance costs, order size, plaque size
Deformation and warping:
Temperature: higher deformation of paper phenolic materials, epoxy resins with less distortion fiberglass.
Level of training: Class-plate (SC or DC), tmño plate, predom. of struct. metal distribution and balance
Minimize deformation, thickness, nerves or buttresses, connectors printed ct
UNIT 1. CAD / CAE / CAM
CAD (computer aided design) technique of designing a computer-based product and its capture programas.Programa schemes.
-Editor: photo editor (library of components)
-Processor (database connectivity): rendering the ct. Designed by simulation programs or implantation in pcb.
Electronic CAE (computer aided engineering): checking the proper functioning of the product designed by computerized means.
Electronic CAM (computer aided manufacturing) manufacturing process control with the help of computer and software. PCB design software. Generation of documentation and information to the practical implementation of product design.
Basis for choosing a CAD / CAE / CAM:
The characteristics examined are:
1.-power design sma (potential of the design package):
a) capture schemes: No library (the larger, more components will) and generation of database connectivity in different formats.
b) simulation: it must belong to the same database schema to capture and pcb layout.
c) PCB design: largely determines the power of design sma. The autorruter always had as main objectives:
-route the board 100%
-route the board in the shortest time possible
quality-routed: Interconnections.
2.-Computer hardware (required for the proper functioning of the package)
a) technological development:
-computing needs for installation and automatic drawing
-Requirements powerful graphics.
-Local Area Network (sharing programs, libraries, components)
b) applications: a computer MEASUREMENT PRINCIPLE was not suitable for the design but the evolution of these is transforming the PC into a sma as powerful as workstations.
ITEM 2. Laminates
Functions of a paper plate: bear down components and interconnections
Advantages against the wiring: Space saving, ease of component assembly, no broken threads or cuts repitibilidad + + + uniform electrical characteristics reliability, simplifying identification of parts of the ct, mass production and automated qualified employees not easy review ( fewer errors)
Limitations of electrical cts: the ability for the designer, longer designed, difficult to repair, little more expensive production
Building blocks: insulating base mounting holes or pathways components, connectors, interconnect plates, terminal E / S, conductive material
Classification of printed boards:
-based support: rigid or flexible
“No planes drivers: SC or DC or MC
Factors cts density printed size and shape of components, number of drivers and components, complexity of conexiones.Medida density = number of holes / unit area
Classification system 1erdígito: type of plate (SC, DC, MC) and interconnection. 2 nd digit: The maximum concentration of drivers depends on: nominal width of the components, nominal separation between conductors, differences between diameters nodes depends on: nominal width components, nominal separation between conductors, differences between diameters nodes and holes
Materials used in the media:
Char: Physical: robustness and stability. Thermal: fabricac support processes, coef tmp.dl mat. Electrical: dielectric strength, insulation resistance.