Field-Effect Transistors and Op-Amp Principles

Construction and Working of an n-channel JFET

Construction

An n-channel JFET consists of a small bar of extrinsic n-type semiconductor material. Two ohmic contacts are made at its ends, serving as the drain (D) and source (S) terminals. Heavily doped p-type electrodes form reverse-biased p-n junctions on both sides of the n-type bar, creating the gate (G) terminals (usually connected together). The thin region between these two p-gates is the n-channel, through which current flows.

Working

The gate-source junction is always reverse-biased, resulting in negligible gate current (IG ≈ 0). A positive drain-source voltage (VDS) causes electrons (majority carriers) to flow from source to drain through the n-channel, producing drain current (ID).

  • Channel Control: The reverse bias creates depletion regions that extend into the channel, narrowing its width. Increasing the reverse gate-source voltage (VGS, negative for n-channel) widens the depletion regions, further narrowing the channel and reducing ID.
  • Saturation: At low VDS, ID increases linearly (ohmic region). Beyond the pinch-off voltage (VP), the channel narrows to a point, but ID saturates due to carrier velocity.
  • Cutoff: At VGS = VGS(OFF) (cutoff voltage, typically -2 to -10 V), the channel is fully depleted, and ID = 0.
  • Maximum Current: When VGS = 0 V, ID = IDSS (maximum drain current).

The JFET acts as a voltage-controlled current source, with characteristics showing ID vs. VDS curves for different VGS levels.

Classification of FET Types

FETs are classified into two main types based on construction and operation:

  • JFET (Junction Field-Effect Transistor): Uses a p-n junction gate formed by reverse-biased p-n junctions to control the channel. It is a unipolar device; current is due to majority carriers only. Subtypes include n-channel (electrons as carriers) and p-channel (holes as carriers). It is normally on; gate voltage depletes the channel to control current.
  • MOSFET (Metal-Oxide-Semiconductor Field-Effect Transistor): Uses an insulated metal gate separated by a SiO2 dielectric; there is no physical p-n junction. Subtypes include:
    • Enhancement MOSFET: Normally off (no channel at VGS = 0 V). Requires positive VGS (n-channel) to induce/invert carriers and form a channel.
    • Depletion MOSFET: Normally on (pre-formed channel). Positive VGS enhances current; negative VGS depletes the channel.

FETs are voltage-controlled, unipolar devices with high input impedance.

Common Collector (CC) Transistor Configuration

Common Collector (CC) Configuration: Also known as an emitter follower or grounded collector. The collector is common to both input and output. The input is applied between the base and collector (ground); the output is taken between the emitter and collector (ground). It is used for buffering due to high input impedance and low output impedance.

  • Biasing: Base-emitter is forward-biased; collector-emitter is reverse-biased.
  • Characteristics:
    • Input: IB vs. VBC (similar to a diode, cut-in ~0.7 V for Si).
    • Output: IE vs. VEC (IE ≈ IC, nearly constant in the active region).
  • Gains: Voltage gain ≈ 1 (follower), current gain is high (β+1), and power gain is medium.
  • Application: Voltage buffer; isolates stages.

Transistor Current and Gain Calculations

First Part

In a BJT, αdc = IC / IE, and IB = IE (1 – αdc).

  • IE = IB / (1 – αdc) = 100 μA / (1 – 0.98) = 100 / 0.02 = 5000 μA = 5 mA.
  • IC = αdc × IE = 0.98 × 5 mA = 4.9 mA.

Explanation: Start with IB = IE – IC. Substitute IC = α IE to get IB = IE (1 – α). Solve for IE, then IC. Verification: IB + IC = 0.1 + 4.9 = 5 mA = IE.

Second Part

If IC is measured as 1 mA and IB is 25 μA:

  • αdc = IC / (IC + IB) = 1 mA / (1 + 0.025) mA = 1 / 1.025 ≈ 0.9756.
  • βdc = IC / IB = 1 mA / 0.025 mA = 40.

Explanation: αdc is the ratio of collector to total emitter current. βdc is the collector-to-base current amplification. From measurements, compute directly.

Determining New Base Current

Using βdc = 40 from the previous calculation, to get IC = 5 mA:

IB = IC / βdc = 5 mA / 40 = 0.125 mA = 125 μA.

Explanation: In the active region, IC = β IB. Solve for IB given the target IC. This assumes a constant β.

n-channel Enhancement MOSFET Construction

Construction

A P-type substrate with two heavily doped n+ regions (source S and drain D). A thin SiO2 dielectric layer covers the substrate between S and D. A metal gate electrode overlays the SiO2, forming a capacitor. There is no pre-existing channel; the substrate connects to the source internally.

Working

Normally off (VGS = 0 V): No inversion layer; high resistance between S-D.

  • Positive VGS attracts electrons to the SiO2-substrate interface, inverting p-type to n-type and forming an n-channel.
  • When VDS > 0 V, electrons flow from S to D through the channel (ID increases with VGS).
  • Threshold voltage (VTH) is required to form the channel (~1-4 V). Beyond VTH, it operates in the linear region (low VDS: ID ∝ VDS) or saturation (high VDS: ID constant).

Enhancement mode: The channel is “enhanced” by gate voltage.

n-channel Depletion MOSFET Construction

Construction

Lightly doped p-type substrate with heavily doped n+ source (S) and drain (D). An n-type channel is diffused between S and D. A thin SiO2 dielectric is placed over the channel with a metal gate on top. Holes are cut in the SiO2 for S/D contacts, and metal is deposited for terminals.

Working

Normally on (pre-formed n-channel conducts at VGS = 0 V).

  • Enhancement Mode (VGS > 0 V): Positive gate attracts more electrons, widening the channel and increasing ID.
  • Depletion Mode (VGS < 0 V): Negative gate repels electrons, depleting the channel, narrowing it, and reducing ID. At pinch-off (VGS(OFF) ≈ -2 to -6 V), ID = 0.
  • With VDS applied, it operates in linear (low VDS) or saturation (high VDS) modes. It operates as a voltage-controlled variable resistor.

Comparative Analysis of Transistors

a) FET vs. BJT

AspectFET (JFET/MOSFET)BJT
ControlVoltage-controlled (VGS)Current-controlled (IB)
CarriersUnipolar (majority only)Bipolar (both electrons/holes)
Input ImpedanceHigh (MΩ, insulated gate)Low (kΩ, base current flows)
Current GainNo (ID controlled by VGS)High (β ≈ 100)
Power HandlingHigh (no base power loss)Medium (base dissipation)
Switching SpeedFast (no minority storage)Slower (storage time)
NoiseLowHigher

FET: High Zin, low noise; used in ICs. BJT: Amplifies current; used in discrete power applications.

b) Enhancement vs. Depletion mode MOSFET

AspectEnhancement MOSFETDepletion MOSFET
Normal StateOff (no channel at VGS=0)On (pre-formed channel)
OperationVGS > VTH to form channelVGS > 0 enhances; VGS < 0 depletes
VGS RangePositive only (n-channel)Positive/negative
ApplicationsLogic switches, digital CMOSAnalog switches, constant current

Enhancement: Power-efficient off-state. Depletion: Analog variable resistor.

Transistor Operation as a Switch

A transistor acts as a switch in digital circuits by operating in the cutoff and saturation regions.

  • Cutoff (OFF): Both junctions are reverse-biased (VBE < 0.7 V, VCE > saturation voltage). IC ≈ 0, VCE ≈ VCC; high resistance (>MΩ), no current flow.
  • Saturation (ON): Both junctions are forward-biased (IB high, VBE ≈ 0.7 V, VCE ≈ 0.2 V). IC is at maximum, low resistance (~10 Ω); full current flow.
  • Switching: Low IB leads to cutoff (open switch). High IB leads to saturation (closed switch). Used in logic gates; fast switching via base pulse.

Transistor Operation as an Amplifier

In the active region (forward-biased BE, reverse-biased CB), a small IB variation causes a large IC change (IC = β IB).

  • Biasing: Set the Q-point in the active region for linear operation.
  • Amplification: The input signal modulates IB → ΔIC = β ΔIB (current gain). Output across RC gives voltage gain Av = -β (RC / re), where re = 26 mV / IE (small-signal).
  • Configurations: CE is used for high gain in audio/RF amps. Power gain is high due to load matching.

Module 3: Operational Amplifiers

Op-Amp Definition, Symbol, and Pin Configuration

Op-Amp: A direct-coupled, multistage, high-gain differential amplifier with high input impedance and low output impedance. Used for amplification, integration, and more.

PIN Configuration (IC 741):

  • Pin 1: Offset Null
  • Pin 2: Inverting Input (-)
  • Pin 3: Non-Inverting Input (+)
  • Pin 4: V- (-VEE)
  • Pin 5: Offset Null
  • Pin 6: Output
  • Pin 7: V+ (+VCC)
  • Pin 8: No Connection

Voltage Transfer Curve (VTC): Sigmoid shape. Linear region near Vi=0 (slope=A, open-loop gain ~105); saturates at ±VCC (e.g., ±13V for 741) for |Vi| > ~50 μV. Narrow linear range due to high gain; used with feedback for linearity.

Internal Block Diagram of an Op-Amp

The Op-Amp block consists of: Input Stage → Intermediate Stage → Level Shifting Stage → Output Stage.

  • Input Stage: Dual-input balanced differential amp (high gain, high Zin, low offset, high CMRR).
  • Intermediate Stage: Multistage differential amp (additional gain).
  • Level Shifting: Adjusts DC level to ground (avoids saturation).
  • Output Stage: Push-pull class AB/B (low Zout, high current drive, short-circuit protection).

Characteristics of an Ideal Op-Amp

  • Infinite open-loop gain (A=∞).
  • Infinite input impedance (Ri=∞, no input current).
  • Zero output impedance (Ro=0).
  • Infinite bandwidth (BW=∞).
  • Infinite CMRR (rejects common signals).
  • Infinite slew rate (S=∞).
  • Zero PSRR (ignores supply variations).
  • Zero offset voltage/current.
  • Temperature-independent.

Characteristics of a Practical Op-Amp

  • Open-loop gain: 2×105.
  • Input impedance: 2 MΩ.
  • Output impedance: 75 Ω.
  • Input offset voltage: 1-6 mV.
  • Input bias current: 80 nA.
  • Input offset current: 20 nA.
  • CMRR: 90 dB.
  • Bandwidth: 1 MHz (unity gain).
  • Slew rate: 0.5 V/μs.
  • PSRR: 30 μV/V.

Ideal vs. Practical Op-Amp Comparison

CharacteristicIdeal Op-AmpPractical Op-Amp
Open-Loop Gain104 to 106
Input Impedance2 MΩ
Output Impedance075-100 Ω
Bandwidth1-100 MHz
CMRR90 dB

Ideal assumes perfect linearity; practical is limited by parasitics and used with feedback.

Key Op-Amp Definitions

  • a) Slew Rate: Maximum dVo/dt (V/μs); limits high-frequency response (e.g., 0.5 V/μs for 741).
  • b) Differential Gain: Ad = Vo / (V+ – V-); amplifies the difference.
  • c) Common Mode Gain: Ac = Vo / [(V+ + V-)/2]; unwanted common signal amplification.
  • d) Common Mode Rejection Ratio: CMRR = Ad / Ac (dB); rejects common signals (90 dB typical).
  • e) Open Loop Voltage Gain: A = Vo / (V+ – V-); ~105 without feedback.
  • f) Input Offset Voltage: Vos = minimum differential input for Vo=0 (~1 mV).
  • g) Input Bias Current: Ib = (Ib+ + Ib-)/2; average base currents (~80 nA).
  • h) Input Offset Current: Iio = |Ib+ – Ib-|; mismatch (~20 nA).
  • i) Power Supply Rejection Ratio: PSRR = ΔVo / ΔVCC (μV/V); supply noise rejection (~30 μV/V).