Field-Effect Transistors and Op-Amp Principles
Construction and Working of an n-channel JFET
Construction
An n-channel JFET consists of a small bar of extrinsic n-type semiconductor material. Two ohmic contacts are made at its ends, serving as the drain (D) and source (S) terminals. Heavily doped p-type electrodes form reverse-biased p-n junctions on both sides of the n-type bar, creating the gate (G) terminals (usually connected together). The thin region between these two p-gates is the n-channel, through which current flows.
Working
The gate-source junction is always reverse-biased, resulting in negligible gate current (IG ≈ 0). A positive drain-source voltage (VDS) causes electrons (majority carriers) to flow from source to drain through the n-channel, producing drain current (ID).
- Channel Control: The reverse bias creates depletion regions that extend into the channel, narrowing its width. Increasing the reverse gate-source voltage (VGS, negative for n-channel) widens the depletion regions, further narrowing the channel and reducing ID.
- Saturation: At low VDS, ID increases linearly (ohmic region). Beyond the pinch-off voltage (VP), the channel narrows to a point, but ID saturates due to carrier velocity.
- Cutoff: At VGS = VGS(OFF) (cutoff voltage, typically -2 to -10 V), the channel is fully depleted, and ID = 0.
- Maximum Current: When VGS = 0 V, ID = IDSS (maximum drain current).
The JFET acts as a voltage-controlled current source, with characteristics showing ID vs. VDS curves for different VGS levels.
Classification of FET Types
FETs are classified into two main types based on construction and operation:
- JFET (Junction Field-Effect Transistor): Uses a p-n junction gate formed by reverse-biased p-n junctions to control the channel. It is a unipolar device; current is due to majority carriers only. Subtypes include n-channel (electrons as carriers) and p-channel (holes as carriers). It is normally on; gate voltage depletes the channel to control current.
- MOSFET (Metal-Oxide-Semiconductor Field-Effect Transistor): Uses an insulated metal gate separated by a SiO2 dielectric; there is no physical p-n junction. Subtypes include:
- Enhancement MOSFET: Normally off (no channel at VGS = 0 V). Requires positive VGS (n-channel) to induce/invert carriers and form a channel.
- Depletion MOSFET: Normally on (pre-formed channel). Positive VGS enhances current; negative VGS depletes the channel.
FETs are voltage-controlled, unipolar devices with high input impedance.
Common Collector (CC) Transistor Configuration
Common Collector (CC) Configuration: Also known as an emitter follower or grounded collector. The collector is common to both input and output. The input is applied between the base and collector (ground); the output is taken between the emitter and collector (ground). It is used for buffering due to high input impedance and low output impedance.
- Biasing: Base-emitter is forward-biased; collector-emitter is reverse-biased.
- Characteristics:
- Input: IB vs. VBC (similar to a diode, cut-in ~0.7 V for Si).
- Output: IE vs. VEC (IE ≈ IC, nearly constant in the active region).
- Gains: Voltage gain ≈ 1 (follower), current gain is high (β+1), and power gain is medium.
- Application: Voltage buffer; isolates stages.
Transistor Current and Gain Calculations
First Part
In a BJT, αdc = IC / IE, and IB = IE (1 – αdc).
- IE = IB / (1 – αdc) = 100 μA / (1 – 0.98) = 100 / 0.02 = 5000 μA = 5 mA.
- IC = αdc × IE = 0.98 × 5 mA = 4.9 mA.
Explanation: Start with IB = IE – IC. Substitute IC = α IE to get IB = IE (1 – α). Solve for IE, then IC. Verification: IB + IC = 0.1 + 4.9 = 5 mA = IE.
Second Part
If IC is measured as 1 mA and IB is 25 μA:
- αdc = IC / (IC + IB) = 1 mA / (1 + 0.025) mA = 1 / 1.025 ≈ 0.9756.
- βdc = IC / IB = 1 mA / 0.025 mA = 40.
Explanation: αdc is the ratio of collector to total emitter current. βdc is the collector-to-base current amplification. From measurements, compute directly.
Determining New Base Current
Using βdc = 40 from the previous calculation, to get IC = 5 mA:
IB = IC / βdc = 5 mA / 40 = 0.125 mA = 125 μA.
Explanation: In the active region, IC = β IB. Solve for IB given the target IC. This assumes a constant β.
n-channel Enhancement MOSFET Construction
Construction
A P-type substrate with two heavily doped n+ regions (source S and drain D). A thin SiO2 dielectric layer covers the substrate between S and D. A metal gate electrode overlays the SiO2, forming a capacitor. There is no pre-existing channel; the substrate connects to the source internally.
Working
Normally off (VGS = 0 V): No inversion layer; high resistance between S-D.
- Positive VGS attracts electrons to the SiO2-substrate interface, inverting p-type to n-type and forming an n-channel.
- When VDS > 0 V, electrons flow from S to D through the channel (ID increases with VGS).
- Threshold voltage (VTH) is required to form the channel (~1-4 V). Beyond VTH, it operates in the linear region (low VDS: ID ∝ VDS) or saturation (high VDS: ID constant).
Enhancement mode: The channel is “enhanced” by gate voltage.
n-channel Depletion MOSFET Construction
Construction
Lightly doped p-type substrate with heavily doped n+ source (S) and drain (D). An n-type channel is diffused between S and D. A thin SiO2 dielectric is placed over the channel with a metal gate on top. Holes are cut in the SiO2 for S/D contacts, and metal is deposited for terminals.
Working
Normally on (pre-formed n-channel conducts at VGS = 0 V).
- Enhancement Mode (VGS > 0 V): Positive gate attracts more electrons, widening the channel and increasing ID.
- Depletion Mode (VGS < 0 V): Negative gate repels electrons, depleting the channel, narrowing it, and reducing ID. At pinch-off (VGS(OFF) ≈ -2 to -6 V), ID = 0.
- With VDS applied, it operates in linear (low VDS) or saturation (high VDS) modes. It operates as a voltage-controlled variable resistor.
Comparative Analysis of Transistors
a) FET vs. BJT
| Aspect | FET (JFET/MOSFET) | BJT |
|---|---|---|
| Control | Voltage-controlled (VGS) | Current-controlled (IB) |
| Carriers | Unipolar (majority only) | Bipolar (both electrons/holes) |
| Input Impedance | High (MΩ, insulated gate) | Low (kΩ, base current flows) |
| Current Gain | No (ID controlled by VGS) | High (β ≈ 100) |
| Power Handling | High (no base power loss) | Medium (base dissipation) |
| Switching Speed | Fast (no minority storage) | Slower (storage time) |
| Noise | Low | Higher |
FET: High Zin, low noise; used in ICs. BJT: Amplifies current; used in discrete power applications.
b) Enhancement vs. Depletion mode MOSFET
| Aspect | Enhancement MOSFET | Depletion MOSFET |
|---|---|---|
| Normal State | Off (no channel at VGS=0) | On (pre-formed channel) |
| Operation | VGS > VTH to form channel | VGS > 0 enhances; VGS < 0 depletes |
| VGS Range | Positive only (n-channel) | Positive/negative |
| Applications | Logic switches, digital CMOS | Analog switches, constant current |
Enhancement: Power-efficient off-state. Depletion: Analog variable resistor.
Transistor Operation as a Switch
A transistor acts as a switch in digital circuits by operating in the cutoff and saturation regions.
- Cutoff (OFF): Both junctions are reverse-biased (VBE < 0.7 V, VCE > saturation voltage). IC ≈ 0, VCE ≈ VCC; high resistance (>MΩ), no current flow.
- Saturation (ON): Both junctions are forward-biased (IB high, VBE ≈ 0.7 V, VCE ≈ 0.2 V). IC is at maximum, low resistance (~10 Ω); full current flow.
- Switching: Low IB leads to cutoff (open switch). High IB leads to saturation (closed switch). Used in logic gates; fast switching via base pulse.
Transistor Operation as an Amplifier
In the active region (forward-biased BE, reverse-biased CB), a small IB variation causes a large IC change (IC = β IB).
- Biasing: Set the Q-point in the active region for linear operation.
- Amplification: The input signal modulates IB → ΔIC = β ΔIB (current gain). Output across RC gives voltage gain Av = -β (RC / re), where re = 26 mV / IE (small-signal).
- Configurations: CE is used for high gain in audio/RF amps. Power gain is high due to load matching.
Module 3: Operational Amplifiers
Op-Amp Definition, Symbol, and Pin Configuration
Op-Amp: A direct-coupled, multistage, high-gain differential amplifier with high input impedance and low output impedance. Used for amplification, integration, and more.
PIN Configuration (IC 741):
- Pin 1: Offset Null
- Pin 2: Inverting Input (-)
- Pin 3: Non-Inverting Input (+)
- Pin 4: V- (-VEE)
- Pin 5: Offset Null
- Pin 6: Output
- Pin 7: V+ (+VCC)
- Pin 8: No Connection
Voltage Transfer Curve (VTC): Sigmoid shape. Linear region near Vi=0 (slope=A, open-loop gain ~105); saturates at ±VCC (e.g., ±13V for 741) for |Vi| > ~50 μV. Narrow linear range due to high gain; used with feedback for linearity.
Internal Block Diagram of an Op-Amp
The Op-Amp block consists of: Input Stage → Intermediate Stage → Level Shifting Stage → Output Stage.
- Input Stage: Dual-input balanced differential amp (high gain, high Zin, low offset, high CMRR).
- Intermediate Stage: Multistage differential amp (additional gain).
- Level Shifting: Adjusts DC level to ground (avoids saturation).
- Output Stage: Push-pull class AB/B (low Zout, high current drive, short-circuit protection).
Characteristics of an Ideal Op-Amp
- Infinite open-loop gain (A=∞).
- Infinite input impedance (Ri=∞, no input current).
- Zero output impedance (Ro=0).
- Infinite bandwidth (BW=∞).
- Infinite CMRR (rejects common signals).
- Infinite slew rate (S=∞).
- Zero PSRR (ignores supply variations).
- Zero offset voltage/current.
- Temperature-independent.
Characteristics of a Practical Op-Amp
- Open-loop gain: 2×105.
- Input impedance: 2 MΩ.
- Output impedance: 75 Ω.
- Input offset voltage: 1-6 mV.
- Input bias current: 80 nA.
- Input offset current: 20 nA.
- CMRR: 90 dB.
- Bandwidth: 1 MHz (unity gain).
- Slew rate: 0.5 V/μs.
- PSRR: 30 μV/V.
Ideal vs. Practical Op-Amp Comparison
| Characteristic | Ideal Op-Amp | Practical Op-Amp |
|---|---|---|
| Open-Loop Gain | ∞ | 104 to 106 |
| Input Impedance | ∞ | 2 MΩ |
| Output Impedance | 0 | 75-100 Ω |
| Bandwidth | ∞ | 1-100 MHz |
| CMRR | ∞ | 90 dB |
Ideal assumes perfect linearity; practical is limited by parasitics and used with feedback.
Key Op-Amp Definitions
- a) Slew Rate: Maximum dVo/dt (V/μs); limits high-frequency response (e.g., 0.5 V/μs for 741).
- b) Differential Gain: Ad = Vo / (V+ – V-); amplifies the difference.
- c) Common Mode Gain: Ac = Vo / [(V+ + V-)/2]; unwanted common signal amplification.
- d) Common Mode Rejection Ratio: CMRR = Ad / Ac (dB); rejects common signals (90 dB typical).
- e) Open Loop Voltage Gain: A = Vo / (V+ – V-); ~105 without feedback.
- f) Input Offset Voltage: Vos = minimum differential input for Vo=0 (~1 mV).
- g) Input Bias Current: Ib = (Ib+ + Ib-)/2; average base currents (~80 nA).
- h) Input Offset Current: Iio = |Ib+ – Ib-|; mismatch (~20 nA).
- i) Power Supply Rejection Ratio: PSRR = ΔVo / ΔVCC (μV/V); supply noise rejection (~30 μV/V).
